[1] Kotadia H R, Howes P D, Manman S H. A review: On the development of low melting temperature Pb-free solders[J]. Microelectronics Reliability, 2014, 54:1253-1273.
[2] Morando C, Fornaro O, Garbellini O, et al. Thermal properties of Sn-based solder alloys[J]. Journal of Materials Science: Materials in Electronics, 2014, 25:3440-3447.
[3] Mei Z, Morris Jr. J W. Characterization of eutectic Sn-Bi solder joints[J]. Journal of Electronic Materials, 1992,21:599-607.
[4] Belyakov S A , Xian J W, Sweatman K, et al. Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints[J]. Journal of Alloys and Compounds, 2017, 701:321-334.
[5] Lin K L, Shih C L. Microstructure and thermal behavior of Sn-Zn-Ag solders[J], Journal of Electronic Materials, 2003, 32:1496-1500.
[6] Y?lmaz E, ?ad?rl? E, Acer E, et al. Microstructural evolution and mechanical properties in directionally solidified Sn-10.2Sb peritectic alloy at a constant temperature gradient[J]. Materials Research. 2016, 19: 370-378.
[7] Osório W R, Leiva D R, Peixoto L C, et al. Mechanical properties of Sn-Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology[J]. Journal of Alloys and Compounds, 2013, 562:194-204.
[8]陈剑明, 张建波, 李明茂.Sn-Bi系低温无Pb焊料的研究现状及发展趋势[J].有色金属材料与工程, 2017, 38(2):112-118.
Chen J M, Zhang J B, Li M M. Review of Sn-Bi low temperature lead-free solder[J]. Nonferrous metal materials and engineering, 2017, 38(2): 112-118.
[9] 杨斌, 陈剑明, 邬善江,等. Sn-58Bi-(0~3)Ga/Cu润湿剪切性能及界面化合物的研究[J].材料导报, 2017, 31(14):92-95.
Bin Y, Chen J M, Wu S J, et al. Study on wetting shearing properties and interface compounds of Sn-58Bi-(0~3)Ga/Cu[J]. Materials Review, 2017, 31(7):92-95.
[10] Chen C, Lee B, Chen H, et al. Interfacial reactions of low-melting Sn-Bi-Ga solder alloy on Cu substrate[J]. Journal of Electronic Materials, 2016, 45(1):197-202.
[11] Yu X, Hu X W, Li Y L, et al. Tensile properties of Cu/Sn-58Bi/Cu soldered joints subjected to isothermal aging[J]. . Journal of Materials Science: Materials in Electronics, 2014, 25:2416-2425.
[12]Miao H W, Duh J G, Chiou B S. Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints[J]. Journal of Materials Science: Materials in Electronics, 2000, 11:609-618.
[13] Ma D L, Wu P. Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of grapheme nanosheets[J]. Journal of Alloys and Compounds, 2016, 671:127-136.
[14] 李群, 黄继华, 张华, 等. Al对Sn58Bi无铅钎料组织及性能的影响[J].电子工艺技术, 2008, 29(1):1-4.
Li Q, Huang J H, Zhang H, et al. Influence of Al on microstructure and mechanical properties of the Sn-58Bi lead-free solder[J]. Electronice Process Technology, 2008, 29(1):1-4.
[15] Xie H X, Friedman D, Mirpuri K, et al. Electromigration damage characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints by three-dimensional X-ray tomography and scanning electron microscopy[J].Journal of Electronic Materials, 2014, 43(1):33-41.
[16] Xie H X, Chawla N. Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints[J].Microelectronics reliability, 2013, 53:733-740.
[17] Xu J C, Xue S B, Xue P, et al. Study on microstructure and properties of Sn-0.3Ag-0.7Cu solder bearing Nd[J].Journal of Materials Science: Materials in Electronics, 2016, 27:8771-8777.
[18] 袁宜耀, 孙勇, 张秀兰, 等.微量稀土元素对Sn-Ag-Sb系合金组织及焊料/Cu界面组织的影响[J]. 金属功能材料, 2008, 15(2):33-36.
Yuan Y Y, Sun Y, Zhang X L, et al. Effect of rare earth elements on microstructure and solder/Cu interfacial microstrueture of Sn-Ag-Sb[J]. Metallic Functional Materials, 2008, 15(2):33-36.
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